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FUJITSU SEMICONDUCTOR DATA SHEET
DS04-23510-2E
ASSP
1.0 GHz band Low Power I/Q Modulator For Direct Conversion
MB54608L/MB54608B
s DESCRIPTION
The MB54608L/B is an I/Q Modulator for direct conversion method, and is used for up to 1.0 GHz band digital cellular phones such as GSM, PDC and so on. MB54608L consists of a frequency doubler, a Flip-flop type quadrature phase shifter, I/Q modulator and a mixer for frequency offset with a separate power supply. Fujitsu's advanced Bipolar process has realized very low current operation(ICC = 16.5 mA @3 V). SSOP-20 and BCC-16 package are available.(MB54608L: SSOP-20, MB54608B: BCC-16)
s FEATURES
* Supporting GSM frequency band Output frequency: 1.0 GHz (max.) Output power: -4 dBm(Typical, VBB = 1.0 Vp-p input) * Low voltage operation: VCC = 2.6 V to 3.8 V
(Continued)
s PACKAGES
20-pin plastic SSOP
16-pad plastic BCC
(FPT-20P-M03)
(LCC-16P-M04)
MB54608L/MB54608B
(Continued) * Low current: Please refer to below table. * Offset mixer on-chip: The separate power supply control is possible. (only MB54608L) * Output power level switch (Mode) enables high power mode
Offset Mixer not used Icc Pout(VBB=1.0 Vp-p) Ips 16.5 mA -4 dBm 19.0 mA -2 dBm Offset Mixer used 22.5 mA -4 dBm 25.0 mA -2 dBm
Mode = Open Mode = GND Mode = Open Mode = GND Normal operation Power down
0.22 mA
0.44 mA
Note:Typical values Further increase of the output power is possible by attaching a resistor at Pcnt pin. * Operating temperature range: Ta = -20 to +75C
2
MB54608L/MB54608B
s PIN ASSIGNMENTS
* MB54608L (SSOP-20)
(TOP VIEW)
RFin 1 GND 2 IFin 3 VCCM 4 LO 5 LOX 6 VCC 7 GND 8 GND 9 GND 10
20 Pcnt 19 PSQ 18 Out 17 PSM 16 VCC 15 Mode 14 I 13 XI 12 XQ 11 Q
(FPT-20P-M03)
* MB54608B (BBC-16)
(TOP VIEW) Q XQ XI I Mode VCC Out 1 2 3 4 5 6 7 8 16 GND 15 14 13 12 11 10 9 GND VCC LOX LO N.C. GND
PSQ N.C. (LCC-16P-M04)
Note: MB54608B doesn't have the off-set Mixer and Pcnt pin.
3
MB54608L/MB54608B
s PIN DESCRIPTIONS * MB54608L (SSOP-20)
Pin no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol RFin GND IFin VccM Lo Lox Vcc GND GND GND Q XQ XI I Mode Vcc PSM Out PSQ Pcnt I/O I -- I -- I/O I/O -- -- -- -- I I I I -- -- I O I -- Descriptions RF input for the offset mixer. When the offset mixer is not used, this pin should be opened. Ground. IF input for the offset mixer. When the offset mixer is not used, this pin should be opened. Power supply for the offset mixer. Power-on/off is possible indepently to the modulator. When the offset mixer is not used, this pin should be switched OFF. Lo input for the I/Q modulator (Output for the offset mixer.) Lo complementary input for the I/Q modulator (Complementary output for the offset mixer.) Power supply for the I/Q modulator. Ground. Ground. Ground. Q signal input for the I/Q modulator. Q signal complementary input for the I/Q modulator. I signal complementary input for the I/Q modulator. I signal input for the I/Q modulator. Output mode switch. Mode = Open: Low power mode. Mode = GND: High power mode. This pin should be connected to ground or left open. Power supply for the I/Q modulator. Power saving control for the offset mixer. When PSM = L(GND), power down mode is selected. When the offset mixer is not used, this pin should be connected to Vcc voltage level or ground. Output for the I/Q modulator. (Open collector) Open is prohibited when power is supplied to Vcc pin. Power saving control for the I/Q modulator. When PSQ = L(GND), power down mode is selected. Further, increasing the output power level is possible by attaching a resistor between Pcnt pin and ground externally.
4
MB54608L/MB54608B
* MB54608B (BCC-16)
Pin no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin nane XQ XI I Mode Vcc Out PSQ N.C. GND N.C. Lo Lox Vcc GND GND Q I/O I I I -- -- O I -- -- -- I/O I/O -- -- -- I Descriptions Q signal complementary input for the I/Q modulator. I signal complementary input for the I/Q modulator. I signal input for the I/Q modulator. Output mode switch. Mode=Open: Low power mode. Mode=GND: High power mode. This pin should be connected to ground or left open. Power supply for the I/Q modulator. Output for the I/Q modulator. (Open collector) Open is prohibited when power is supplied to Vcc pin. Power saving control for the I/Q modulator. When PSQ = L(GND), power down mode is selected. No connection. Ground. No connection. Lo input for the I/Q modulator (Output for the offset mixer.) Lo complementary input for the I/Q modulator (Complementary output for the offset mixer.) Power supply for the I/Q modulator. Ground. Ground. Q signal input for the I/Q modulator.
5
MB54608L/MB54608B
s BLOCK DIAGRAM
VCCM
PSM
LO
I
XI
PSQ
VCC
Offset Mixer
I/Q Modulator 0
RFin
x2
1/2 -90
Out Pcnt Mode
IFin
LOX
GND
Q
XQ
Note: MB54608B doesn't have VCCM, PSM, RFin, IFin and Pcnt pins.
6
MB54608L/MB54608B
s ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Output voltage Input voltage Allowed voltage on the open collector pin Output current Storage temperature Symbol VCC VO VI VOC IO Tstg Rating Min. -0.5 -0.5 -0.5 VCC - 0.3 (-0.5) 0 -55 Max. +5.0 VCC + 0.5 (<5.0) VCC + 0.5 (<5.0) VCC + 0.3 (5.0) +10 +125 Unit V V V V mA C Out pin, Open is prohibited. Remarks
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
s RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage Input voltage Allowed voltage on the open collector pin Operating temperature Symbol VCC VI VOC Ta Value Min. 2.6 GND VCC - 0.2 -20 Typ. 3.0 -- -- -- Max. 3.8 VCC VCC + 0.2 +75 Unit V V V V Out pin. Open is prohibited. Ambient temperature. Remarks
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand.
7
MB54608L/MB54608B
s ELECTRICAL CHARACTERISTICS
1. DC CHARACTERISTICS (MB54608L, MB54608B)
(Ta = +25C, VCC = 3.0 V) Parameter Symbol Value Min. Typ. Max. Unit Offset mix. 12.0 Power supply current ICC 13.5 16.0 18.0 Power down current Power down pin input voltage IPS VIHPS VILPS IIHPS Power down pin input current Pcnt pin load resistance IILPS Rcnt -- -- VCC x 0.7 -- -- -50 50 16.5 19.0 22.5 25.0 220 440 -- -- -- -- -- 24.5 28.0 33.5 37.0 310 620 -- VCC x 0.3 5.0 -- -- mA mA mA mA A A V V A A VIH = VCC VIL = GND PSM, PSQ Value Not used Not used Used Used Not used Used Remarks Mode pin Open GND Open GND Don't care DC. No AC signal input.
Note: MB54608B doesn't have Offset mix., so please refer to "offset mix. = Not used" column in regard to power supply current.
8
MB54608L/MB54608B
2. AC CHARACTERISTICS
* A case of the offset mixer is used. (only MB54608L) (Ta = +25C, VCC = 3.0 V) Parameter Operating band Baseband input Input amplitude Offset voltage Offset current Operating band Offset Mixer Input power level Operating band RF output SSB output power level Amplitude error Modulation accuracy Phase error Vector error Carrier suppression Image rejection Adjucent channel power IF x 7 spurious Symbol fBB VBB VOS IOS fRF fIF fLO PRF PIF fOUT Value Min. DC 0.3 1.4 -- -- -- 800 -15 -15 800 -8 POUT -6 AERR PERR VERR CS IR ACP IF x 7 -- -- -- -- -- -- -- -2 2.0 1.5 3.0 -35 -40 -65 -65 - 3.0 2.0 4.0 -27 -28 -60 -60 dBm % deg. % dBc dBc dB dBc f = 50 kHz Typ. -- 1.0 1.5 3.0 1078.5 130.5 948 -10 -10 948 -4 Max. 10 1.3 1.6 4.0 1100 500 1000 0 0 1000 - Unit MHz Vp-p Single ended input V A MHz MHz MHz Output dBm dBm MHz dBm Mode pin is opened Mode pin is grounded RMS value RMS value RMS value External offset. No offset adjustment. VBB = 1.0 Vp-p (single ended input) fRF = 1078.5 MHz PRF = -10 dBm fIF = 130.5 MHz PIF = -10 dBm fOUT = 948 MHz External offset voltage Remarks
9
MB54608L/MB54608B
* A case of the offset mixer is not used. (MB54608L, MB54608B) (Ta = +25C, VCC = 3.0 V) Parameter Operating band Baseband input Input amplitude Offset voltage Offset current Lo input Operating band Input power Operating band RF output SSB output power level Amplitude error Modulation accuracy Phase error Vector error Carrier suppression Image rejection Adjucent channel power Symbol fBB VBB VOS IOS fLO PLO fOUT Value Min. DC 0.3 1.4 -- 800 -15 800 -8 POUT -6 AERR PERR VERR CS IR ACP -- -- -- -- -- -- -2 2.0 1.5 3.0 -35 -40 -65 -- 3.0 2.0 4.0 -27 -28 -60 dBm % deg. % dBc dBc dB f = 50 kHz Typ. -- 1.0 1.5 3.0 948 -10 948 -4 Max. 10 1.3 1.6 4.0 1000 0 1000 -- Unit MHz Vp-p Single ended input V A MHz Differential input with balun. dBm MHz dBm Mode pin is opened Mode pin is grounded RMS value RMS value RMS value External offset. No offset ajustment. VBB = 1.0 Vp-p (single ended input) fLO = 948 MHz PLO = -10 dBm (Differential input with balun). External offset voltage Remarks
Notes: * Spec. of MB54608B is identical with MB54608L. * When the offset mixer is not used, using a differential balun is recommended for input. (When the balun is not used, the changing carrier suppression may happen depending on the timing of powering up.)
10
MB54608L/MB54608B
s APPLICATION EXAMPLE (MB54608L)
1) A case of the offset mixer is used.
Output 15 nH 10 pF 18 nH 0.1 F Open VCC Pcnt 20 19 PSQ 18 Out 17 VCC PSM VCC 16 15 Vbi I Vbix
100 F 100 F
Vbqx Q Vbq
100 F 100 F
1 k Mode 14
1 k I XI 13
1 k XQ 12
1 k Q 11
MB54608L
1 fRF = 1078.5 MHz RFin
2 GND
3 IFin
4 VCCM
5 LO 3.9 nH
6 LOX
7 VCC
8 GND
9 GND
10 GND 3.0 V
S.G. 1000 pF fRF = 130.5 MHz S.G.100 pF 0.1 F 0.1 F 1.5-5 pF
2) A case of the offset mixer is not used.
Output 15 nH 10 pF 18 nH 0.1 F Open VCC Pcnt 20 19 PSQ 18 Out 17 VCC PSM VCC 16 15 Vbi I Vbix
100 F 100 F
Vbqx Q Vbq
100 F 100 F
1 k Mode 14
1 k I XI 13 12
1 k XQ 11
1 k Q
MB54608L
1 RFin
2 GND
3 IFin
4 VCCM 100 pF
5 LO
6 LOX 100 pF
7 VCC
8 GND
9 GND
10 GND 3.0 V
LDB25C201A0950 fLO = 948 MHz S.G.
0.1 F
Note: LDB25C201A0950: Murata Mfg. Co., Ltd.
(Continued)
11
MB54608L/MB54608B
(Continued)
(MB54608L)
VCC = 3.0 V 0.1 F fLO = 948 MHz
100 pF
100 pF
14 GND 15
13 VCC
12 LOX
11 LO
10 N.C.
9 GND
GND MB54608B
N.C. 8
Q 100 F Vbq 1 k
16 XQ 1
Q XI 2 I 3 Mode 4
PSQ 7 VCC 5 Out 6
100 F 1 k
100 F
Vbqx
100 F 1 k
1 k Open
22 nH 30 pF Output 18 nH 0.1 F
Vbix I Vbi
s ORDERING INFORMATION
Part number MB54608L PFV MB54608L PV1 Package 20-pin, Plastic SSOP (FPT-20P-M03) 16-pad, Plastic BCC (LCC-16P-M04) Remarks MB54608L MB54608B
12
MB54608L/MB54608B
s PACKAGE DIMENSION
20-pin Plastic SSOP (FPT-20P-M03)
* 6.500.10(.256.004)
20 11
Note 1) *:This dimension does not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness.
0.170.03 (.007.001)
* 4.400.10
INDEX
6.400.20 (.173.004) (.252.008)
Details of "A" part 1.25 -0.10 .049 -.004 LEAD No.
1 10
+0.20 +.008
(Mounting height)
0.65(.026)
"A" 0.240.08 (.009.003) 0.13(.005)
M
0~8 0.100.10 (Stand off) (.004.004) 0.25(.010)
0.10(.004)
0.500.20 (.020.008) 0.45/0.75 (.018/.030)
C
1999 FUJITSU LIMITED F20012S-3C-5
Dimensions in mm (inches)
(Continued)
13
MB54608L/MB54608B
(Continued)
16-pad Plastic BCC (LCC-16P-M04)
4.550.10 (.179.004)
14 9
0.80(.031)MAX Mounting height 0.65(.026) TYP
9
3.40(.134)TYP 0.3250.10 (.013.004)
14
0.80(.031) REF
INDEX AREA
4.200.10 (.165.004)
3.25(.128) TYP "A" "B" 1.55(.061) REF
0.400.10 (.016.004)
1
6
0.0750.025 (.003.001) (Stand off)
6
1.725(.068) REF Details of "B" part 0.600.10 (.024.004)
1
Details of "A" part 0.750.10 (.030.004) 0.05(.002)
0.400.10 (.016.004)
0.600.10 (.024.004)
C
1999 FUJITSU LIMITED C16015S-1C-1
Dimensions in mm (inches)
14
MB54608L/MB54608B
FUJITSU LIMITED
All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan.
F0001 (c) FUJITSU LIMITED Printed in Japan

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